Li-Hsin Tseng
8Patents
5h-index
28Co-inventors
55Inventor score
Filing activity: Dec 31, 2001 → Mar 6, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7122458B2 | Method for fabricating pad redistribution layer | Electricity | 26 | Expired |
| US6486054B1 | Method to achieve robust solder bump height | Electricity | 12 | Expired |
| US6696356B2 | Method of making a bump on a substrate without ribbon residue | Electricity | 10 | Expired |
| US7459386B2 | Method for forming solder bumps of increased height | Electricity | 10 | Expired |
| US7187078B2 | Bump structure | Electricity | 8 | Expired |
| US7964936B2 | Electronic device package with electromagnetic compatibility (EMC) coating thereon | Electricity | 2 | Active |
| US8669658B2 | Crosstalk-free WLCSP structure for high frequency application | Electricity | 0 | Active |
| US8355628B2 | Compact camera module | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.