Semiconductor device and methods of manufacturing the same
US7968447B2 · kind B2 · utility
8Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2009 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Oct 17, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device may include plugs disposed in a zigzag pattern, interconnections electrically connected to the plugs and a protection pattern which is interposed between the plugs and the interconnections to selectively expose the plugs. The interconnections may include a connection portion which is in contact with plugs selectively exposed by the protection pattern. A method of manufacturing a semiconductor device includes, after forming a molding pattern and a mask pattern, selectively etching a protection layer using the mask pattern to form a protection pattern exposing a plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.