Patent · US Active

Package having a plurality of mounting orientations

US7968807B2 · kind B2 · utility

0Cited by

14References

19Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Timothy Spooner · Dunstable, US
Nelson Kuan · Brookline, US

Key dates

Filing date	Jul 20, 2007
Grant date	Jun 28, 2011
Priority date	—
Expiry date	Dec 28, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49128
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package apparatus has a base coupled with a lid to form a leadframe package. The package has first and second exterior surfaces with respective first and second contact patterns. The first and second contact patterns are substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.