Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
US7968999B2 · kind B2 · utility
12Cited by
10References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2008 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Aug 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of grounding a heat spreader/stiffener to a flip chip package comprising the steps of attaching an adhesive film to a substrate and attaching a stiffener to the adhesive film. The adhesive film may have a number of first holes corresponding with a number of grounding pads on the substrate. The grounding pads may be configured to provide electrical grounding. The stiffener may have a number of second holes corresponding with the number of first holes of the adhesive film and number the grounding pads of the substrate. The grounding pads are generally exposed through the first and the second holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.