Circuit board structure having electronic components integrated therein
US7969745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2008 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Apr 29, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09763
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a circuit board having electronic components integrated therein, including a carrier board having an metallic oxide layer formed on each two surfaces of a metal layer, and having at least one through cavity; at least a semiconductor chip hold in the opening; at least a capacitor disposed on one surface of the carrier board, wherein the surface with the capacitor disposed thereon is at the same side with the active surface of the semiconductor chip. The capacitor is constituted of a first electrode plate disposed on partial surface of one side of the carrier board, a high dielectric material layer disposed on the surface of the first electrode plate, and a second electrode plate, paralleling and corresponding to the first electrode plate, disposed on the surface of the high dielectric material. The metal layer and the oxidation layer of the carrier board can enhance rigidity as well as tenacity and also integrate semiconductor chips and capacitors in the circuit board structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.