Method for controlling semiconductor manufacturing apparatus and control system of semiconductor manufacturing apparatus
US7970486B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2007 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Apr 25, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method for controlling a semiconductor manufacturing apparatus for processing wafers divided for each lot, has acquiring quality control value data group containing quality control value data of wafers in a plurality of lots previously processed, and an equipment engineering system parameter group containing equipment engineering system parameters corresponding to the wafers; creating a prediction formula of quality control value data, acquiring a first equipment engineering system parameters; inputting the first equipment engineering system parameters to the prediction formula, and performing calculation to predict first quality control value data of the wafers in the first lot; determining processing of the wafers corresponding to the first quality control value data; acquiring measured first quality control value data of the wafers in the first lot; replacing the quality control value data corresponding to the wafers in the first processed lot; updating the prediction formula.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.