Patent · US Active

Sawing strip and method for simultaneously cutting off a multiplicity of slices from a cylindrical workpiece using a sawing strip

US7971584B2 · kind B2 · utility

2Cited by
8References
15Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJul 6, 2007
Grant dateJul 5, 2011
Priority date
Expiry dateMay 3, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T83/9292
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A sawing strip for fixing a substantially cylindrical workpiece when cutting off slices from this workpiece with a wire saw has a first face, which is concavely curved perpendicular to its longitudinal direction for connecting to the workpiece, a second face opposite the first face for connecting to a mounting plate, and two side faces which connect the first face and the second face, two edges of the sawing strip at which the side faces meet the first face at a distance a from each other, an imaginary line on the first face marking its minimum distance d from the second face, the side faces being at a distance b, measured at the height of the line and perpendicular to the distance d, wherein the distance b is less than the distance a. The sawing strip is useful for decreasing waviness of wafers cut from a cylindrical workpiece using the sawing strip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.