Method and apparatus for thinning a substrate
US7972969B2 · kind B2 · utility
2Cited by
8References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2008 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Sep 5, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for controlling substrate thickness. At least one etchant is dispensed from at least one dispenser to a plurality of different locations on a surface of a spinning substrate to perform etching. A thickness of the spinning substrate is monitored at the plurality of locations, so that the thickness of the substrate is monitored at each individual location while dispensing the etchant at that location. A respective amount of etching performed at each individual location is controlled, based on the respective monitored thickness at that location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.