Coupler structure

US7973358B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Andre Hanke · Mülheim an der Ruhr, DE
• Oliver Nagy · Wien, AT

Key dates

• Filing date: Aug 7, 2008
• Grant date: Jul 5, 2011
• Expiry date: Aug 3, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01P5/18
• WIPO field: Telecommunications
• WIPO sector: Electrical engineering

Abstract

One or more embodiments relate to a semiconductor device, comprising: a substrate; and a radio frequency coupler including a first coupling element and a second coupling element spacedly disposed from the first coupling element, the first coupling element including at least one through-substrate via disposed in the substrate, the second coupling element including at least one through-substrate via disposed in the substrate.