Patent · US Active

Method and apparatus for detecting a crack in a semiconductor wafer, and a wafer chuck

US7973547B2 · kind B2 · utility

11Cited by

3References

23Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Alois Nitsch · Munich, DE
Rainer Tilgner · Birkenfeld, DE
Horst Baumeister · Hersbruck, DE

Key dates

Filing date	Aug 13, 2008
Grant date	Jul 5, 2011
Priority date	—
Expiry date	Apr 23, 2029

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2853
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method for detecting a crack in a semiconductor wafer, which includes an electrical device and a connecting pad electrically coupled with the electrical device, is described. The crack is detected by an acoustic detector being acoustically coupled to the semiconductor wafer during contacting the contacting pad with a probe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.