Semiconductor device manufacturing method
US7976716B2 · kind B2 · utility
0Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2009 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Feb 7, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of using a heat exchanger efficiently and uniformly to cool or heats portions to be controlled to a prescribed temperature, and then continuously carry out stable processing. The heat exchanger is constructed by arranging partition walls between two plates to form a fluid channel and a fin parallel with the channel or inclined by a prescribed angle on each of the two plates insides the channel so that the plate or a member in contact with the plate is cooled or heated with the fluid flowing through the channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.