Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner
US7977034B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2010 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Jan 20, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.