Method for fabricating highly reliable interconnects
US7977241B2 · kind B2 · utility
0Cited by
8References
16Claims
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Key dates
| Filing date | Dec 20, 2007 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Jun 10, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of fabricating highly reliable tungsten interconnects takes into consideration the effects of charging that can occur within a CMP apparatus due to unrestricted DI water flow, limited only by house supply. Such effects are addressed with the use of a variable pressure input constant flow output in-line controller to the DI water line coupled to the head cleaning loading and unloading module of the CMP apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.