Leadframe including die paddle apertures for reducing delamination
US7977773B1 · kind B1 · utility
5Cited by
3References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 3, 2007 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Jan 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present invention provide leadframes including a die paddle including one or more apertures defined therein, and electronic packages employing the same and having a microelectronic device mounted on the die paddle over one or more of the apertures. Other embodiments may be described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.