Saw debris reduction in MEMS devices
US7977786B2 · kind B2 · utility
2Cited by
1References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2008 |
| Grant date | Jul 12, 2011 |
| Priority date | — |
| Expiry date | Oct 8, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/019
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An improved MEMS device and method of making. Channels are formed in a first substrate around a plurality of MEMS device areas previously formed on the first substrate. Then, a plurality of seal rings are applied around the plurality of MEMS device areas and over at least a portion of the formed channels. A second substrate is attached to the first substrate, then the seal ring surrounded MEMS device areas are separated from each other. The channels include first and second cross-sectional areas. The first cross-sectional area is sized to keep saw debris particles from entering the MEMS device area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.