Integrated circuit with stress sensing element
US7980138B2 · kind B2 · utility
28Cited by
3References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 29, 2007 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Oct 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit includes a semiconductor die, and a stress sensing element. The stress sensing element comprises a first lateral resistor and a first vertical resistor. The stress sensing element is formed in the semiconductor die and is configured to indicate a level of at least one stress component within the semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.