Adhesive chuck and substrate bonding apparatus
US7980287B2 · kind B2 · utility
8Cited by
1References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 3, 2008 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Oct 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.