Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same
US7981317B2 · kind B2 · utility
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1References
8Claims
0Family size
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Key dates
| Filing date | Sep 22, 2008 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Mar 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0315
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.