Patent · US Active

Copper plating connection for multi-die stack in substrate package

US7981726B2 · kind B2 · utility

0Cited by

3References

5Claims

0Family size

Assignee

Intel Corporation · US

Inventors

John Tang · Phoenix, US
Henry Xu · Shanghai, CN
Jianmin Li · Beijing, CN
Xiang Yin Zeng · Shanghai, CN

Key dates

Filing date	Dec 12, 2005
Grant date	Jul 19, 2011
Priority date	—
Expiry date	Dec 2, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/30107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.