John Tang
12Patents
5h-index
26Co-inventors
62Inventor score
Filing activity: Apr 30, 2001 → Dec 12, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6888240B2 | High performance, low cost microelectronic circuit package with interposer | Emerging Cross-Sectional Technologies | 130 | Expired |
| US7183658B2 | Low cost microelectronic circuit package | Electricity | 62 | Expired |
| US7511359B2 | Dual die package with high-speed interconnect | Electricity | 9 | Active |
| US6803649B1 | Electronic assembly | Electricity | 9 | Expired |
| US7435664B2 | Wafer-level bonding for mechanically reinforced ultra-thin die | Electricity | 7 | Active |
| US7405364B2 | Decoupled signal-power substrate architecture | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7714432B2 | Ceramic/organic hybrid substrate | Electricity | 2 | Expired |
| US7989916B2 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | Electricity | 0 | Active |
| US7670919B2 | Integrated capacitors in package-level structures, processes of making same, and systems containing same | Electricity | 0 | Active |
| US7981726B2 | Copper plating connection for multi-die stack in substrate package | Electricity | 0 | Active |
| US10346915B1 | Systems and methods for hierarchical dual-dynamic exception management | Physics | 0 | Active |
| US11126971B1 | Systems and methods for privacy-preserving enablement of connections within organizations | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.