Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
US7982310B2 · kind B2 · utility
6Cited by
6References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2009 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Sep 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.