Substrate inductive devices and methods
US7982572B2 · kind B2 · utility
9Cited by
20References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2009 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Jul 15, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4902
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.