Wafer level packaging image sensor module having lens actuator and method of manufacturing the same
US7982982B2 · kind B2 · utility
1Cited by
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4Claims
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Key dates
| Filing date | Jan 16, 2009 |
| Grant date | Jul 19, 2011 |
| Priority date | — |
| Expiry date | Oct 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
Abstract
Disclosed herein is a wafer level packaging image sensor module, including a wafer including an image sensor, a circuit portion and a lower electrode on one side thereof, a lens actuator disposed on the lower electrode and made of electroactive polymer, an upper electrode disposed on the lens actuator, and a lens unit disposed on the upper electrode to allow light to be transmitted to the image sensor therethrough. The wafer level packaging image sensor module includes the lens actuator made of electroactive polymer, and thus it enables realization of the autofocusing of the wafer level packaging image sensor module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.