Manufacture of an integrated fluid delivery system for semiconductor processing apparatus
US7984891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2007 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Oct 29, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49906
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.