Patent · US Active

Manufacture of an integrated fluid delivery system for semiconductor processing apparatus

US7984891B2 · kind B2 · utility

1Cited by
26References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 20, 2007
Grant dateJul 26, 2011
Priority date
Expiry dateOct 29, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49906
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A space-conserving integrated fluid delivery system which is particularly useful for gas distribution in semiconductor processing equipment. The fluid delivery system includes an integrated fluid flow network architecture, which may include, in addition to a layered substrate containing fluid flow channels, various fluid handling and monitoring components. The layered substrate is diffusion bonded, and the various fluid handling and monitoring components may be partially integrated or fully integrated into the substrate, depending on design and material requirements.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.