Patent · US Active

Systems and methods for selecting wafer processing order for cyclical two pattern defect detection

US7987014B2 · kind B2 · utility

0Cited by
8References
20Claims
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Key dates

Filing dateMay 15, 2008
Grant dateJul 26, 2011
Priority date—
Expiry dateMay 26, 2030

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P90/02
  • WIPO fieldControl
  • WIPO sectorInstruments

Abstract

A method of sequencing wafer processing order to minimize sequence correlation in a cyclical two pattern model by generating a set of sequences of wafer identifiers that each specify an order by which one or more fabrication equipments processes wafers of a wafer lot, where the wafer lot contains a number of slots and the fabrication equipments each includes a first subsystem for processing wafers in odd-numbered slots of the first wafer lot and a second subsystem for processing wafers in even-numbered slots of the first wafer lot, and where each of the generated wafer sequences contains exactly a number of wafer identifiers that match the wafer identifiers in every other wafer sequence indexed in the set.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.