Intelligent stitching boundary defect inspection
US7987057B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 27, 2008 |
| Grant date | Jul 26, 2011 |
| Priority date | — |
| Expiry date | Oct 28, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of inspecting a pattern on a substrate, by extracting boundary locations from design data for repeating blocks within the pattern, inspecting the substrate at only the boundary locations of the repeating blocks, detecting alignment errors at the boundary locations, comparing the alignment errors to a threshold, and flagging the alignment errors that exceed the threshold. In this manner, the alignment errors that were of no consequence in larger design rule devices can be detected, and a determination can be made as to whether they adversely impact the proper operation of the integrated circuit that will eventually be formed from the pattern. By performing the inspection only on the boundary locations, a much higher magnification can be used than what would be reasonably possible for an inspection of the entire substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.