Electroless deposition of cobalt alloys
US7988774B2 · kind B2 · utility
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16References
17Claims
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Key dates
| Filing date | Aug 10, 2010 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Aug 10, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods for electroless deposition of a cobalt-alloy layer on a copper surface include a solution characterized by a low pH. This solution may include, for example, a cobalt(II) salt, a complexing agent including at least two amine groups, a pH adjuster configured to adjust the pH to below 7.0, and a reducing agent. In some embodiments, the cobalt-alloy is configured to facilitate bonding and copper diffusion characteristics between the copper surface and a dielectric in an integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.