Resin composite copper foil, printed wiring board, and production processes thereof
US7989081B2 · kind B2 · utility
3Cited by
6References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 25, 2007 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Mar 5, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.