Fabricating a gallium nitride device with a diamond layer
US7989261B2 · kind B2 · utility
1Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2008 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Sep 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/8503
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one aspect, a method includes fabricating a device. The device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer.In another aspect, a device includes a gallium nitride (GaN) layer, a diamond layer disposed on the GaN layer and a gate structure disposed in contact with the GaN layer and the diamond layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.