Patent · US Active

Method for manufacturing a micromechanical chip and a component having a chip of this type

US7989263B2 · kind B2 · utility

3Cited by

4References

10Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Torsten Kramer · Wannweil, DE
Christoph Schelling · Stuttgart, DE
Christina Leinenbach · Ensdorf, DE

Key dates

Filing date	Aug 31, 2009
Grant date	Aug 2, 2011
Priority date	—
Expiry date	Jan 2, 2030

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2207/07
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

In a method for manufacturing a micromechanical chip, a sacrificial layer and an epitaxy layer are initially applied to a semiconductor substrate to produce a layer stack. An opening is subsequently introduced into the epitaxy layer from the front side of the layer stack. In order to electrically insulate the subsequent filling of the opening using a conductive contact layer from the material of the epitaxy layer, the walls of the opening are provided with an insulating layer. For removing the sacrificial layer and thus for producing the chip, separation trenches are subsequently etched through the epitaxy layer to the sacrificial layer also from the front side of the layer stack, which separation trenches also delimit the lateral extension of the chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.