Chip embedded substrate and method of producing the same
US7989707B2 · kind B2 · utility
50Cited by
5References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2006 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Jul 23, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of producing a chip embedded substrate is disclosed. This method comprises a first step of mounting a semiconductor chip on a first substrate on which a first wiring is formed; and a second step of joining the first substrate with a second substrate on which a second wiring is formed. In the second step, the semiconductor chip is encapsulated between the first substrate and the second substrate and electrical connection is made between the first wiring and the second wiring so as to form multilayered wirings connected to the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.