Semiconductor device and method for cutting electric fuse
US7989913B2 · kind B2 · utility
3Cited by
1References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 11, 2007 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Sep 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electric fuse includes: a first interconnect and a second interconnect, formed on a semiconductor substrate; a fuse link, formed on the semiconductor substrate and provided so that an end thereof is coupled to the first interconnect, the fuse link being capable of electrically cutting the second interconnect from the first interconnect; and an electric current inflow terminal and an electric current drain terminal for cutting the fuse link, formed on the semiconductor substrate and provided in one end and another end of the first interconnect, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.