Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier
US7989934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2008 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Mar 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/244
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier (100) for bonding a semiconductor chip (114) onto is provided, wherein the carrier (100) comprises a die pad (101) and a plurality of contact pads (102), wherein each of the plurality of contact pads (102) comprises an electrically conductive multilayer stack, wherein the electrically conductive multilayer stack comprises a surface layer (109), a first buffer layer, and a first conductive layer (108). Furthermore, the first buffer layer comprises a material adapted to prevent diffusion of material of the surface layer (109) into the first conductive layer (108), and at least two of the contact pads (102) has an ultrafine pitch relative to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.