PCB and manufacturing method thereof
US7992296B2 · kind B2 · utility
2Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2009 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Jan 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and a manufacturing method thereof are disclosed. The method in accordance with an embodiment of the present invention includes: providing a substrate on which a first insulation layer, a first circuit pattern, a second insulation layer and a resin layer are successively laminated; boring a through-hole penetrating the substrate; forming roughness on the resin layer by a desmear process; forming a via making an electrical connection between layers through the through-hole; and forming a second circuit pattern on the resin layer having roughness formed thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.