Heating apparatus, heating method, and computer readable storage medium
US7992318B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2008 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Apr 22, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.