Methods and apparatus for processing a substrate
US7993485B2 · kind B2 · utility
11Cited by
18References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2005 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Jul 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02021
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and methods adapted to polish an edge of a substrate include a polishing film, a frame adapted to tension and load the polishing film so that at least a portion of the film is supported in a plane, and a substrate rotation driver adapted to rotate a substrate against the plane of the polishing film such that the polishing film is adapted to apply force to the substrate, contour to an edge of the substrate, the edge including at least an outer edge and a first bevel, and polish the outer edge and the first bevel as the substrate is rotated. Numerous other aspects are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.