Lead frame, electronic component including the lead frame, and manufacturing method thereof
US7993980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2008 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Sep 22, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame of the present invention includes: a die pad on which a device is mounted; a first connection terminal which is provided around the die pad, and the lower surface of which serves as an external terminal; a second connection terminal which is provided around the die pad and electrically independent of the die pad, and the upper surface of which serves as an external terminal; a bent part provided between the first and the second connection terminals and connecting the first and the second connection terminals; and an outer frame. The bent part is bending-processed in a direction perpendicular to a face of the die pad. Within the outer frame, electronic component regions are formed adjoining each other and each including a die pad, and the first and the second connection terminals. The adjoining electronic components are connected through the first or the second connection terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.