Method of making a semiconductor chip assembly with chip and encapsulant grinding
US7993983B1 · kind B1 · utility
30Cited by
172References
60Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Nov 3, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3651
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, then forming an encapsulant that covers the chip, then grinding the encapsulant without grinding the chip and then grinding the encapsulant and the chip such that the encapsulant and the chip are laterally aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.