Semiconductor chip and semiconductor device
US7994638B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | May 9, 2008 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Oct 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In this semiconductor chip 3, a table electrode 13 is interposed between a bump electrode 14 and an electrode pad 6. The table electrode 13 is formed by forming a plurality of cores 15 having a smaller Young's modulus than the bump electrode 14, on the electrode pad 6, and then covering the surfaces of the cores 15 with a conductive electrode 16. When the semiconductor chip 3 is flip-chip mounted, the bump electrode 14 is plastically deformed and the table electrode 13 is elastically deformed appropriately, thereby obtaining a good conductive state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.