High performance large tolerance heat sink
US7995344B2 · kind B2 · utility
40Cited by
44References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2007 |
| Grant date | Aug 9, 2011 |
| Priority date | — |
| Expiry date | Jan 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink apparatus for electronic components provides a heat sink and a deformable, convex foil construction affixed to the heat sink around a periphery of the foil construction and adapted to extend away from the heat sink to enable deformation of the convex foil construction as a result of contact with a top surface of an electronic component mounted opposite the foil construction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.