Electroplating method
US7998332B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jun 30, 2008 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Jan 25, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.