Controlled electrochemical polishing method
US7998335B2 · kind B2 · utility
66Cited by
21References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2005 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Sep 30, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.