Semiconductor device

US7998797B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Thomas Killer · Hohenschambach, DE
• Erich Syri · Wenzenbach, DE
• Gerold Gruendler · Regensburg, DE
• Juergen Hoegerl · Regensburg, DE
• Volker Strutz · Tegernheim, DE
• Hermann Josef Lutz · Marktoberdorf, DE

Key dates

• Filing date: Dec 9, 2008
• Grant date: Aug 16, 2011
• Expiry date: Feb 8, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19041
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of assembling a semiconductor device includes providing a chip attached to an elastic carrier, and supporting the elastic carrier with a stiffener. The method additionally includes removing the stiffener from the elastic carrier after attaching the elastic carrier to a board.