Flexible thermoelectric device
US7999172B2 · kind B2 · utility
9Cited by
25References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2007 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Oct 24, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C43/18
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A flexible thermoelectric device and a manufacturing method thereof are provided. Flexible substrates are formed by using LIGA process, micro-electro-mechanical process or electroforming technique. The flexible substrates are used to produce thermoelectric device. The structure and the material property of the substrates offer flexible property and tensile property to the thermoelectric device. Thermal transfer enhancement structures such as thermal via or metal diffusion layer are formed on the flexible substrates to overcome the low thermal transfer property of the flexible substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.