Package for monolithic compound semiconductor (CSC) devices for DC to DC converters
US7999365B2 · kind B2 · utility
4Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2008 |
| Grant date | Aug 16, 2011 |
| Priority date | — |
| Expiry date | Aug 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multichip module defining a dc to dc converter employs a monolithic chip containing at least two III-nitride switches (a monolithic CSC chip) mounted on a conductive lead frame. The CSC chip is copacked with an IC driver for the switches and with the necessary passives. The module defines a buck converter; a boost converter, a buck boost converter, a forward converter and a flyback converter. The drain, source and gate pads of the monolithic CSC chip are connected to a lead frame by solder or epoxy or by bumping attach and a conductive connector or wire bonds connect the switch terminal to lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.