Patent · US Active

Micro-component packaging process and set of micro-components resulting from this process

US7999366B2 · kind B2 · utility

5Cited by

13References

5Claims

0Family size

Assignee

STMicroelectronics SA

Inventors

Guillaume Bouche · Albany, US
Bernard Andre · Grenoble, FR
Nicolas Sillon · Fontaine, FR

Key dates

Filing date	Nov 28, 2005
Grant date	Aug 16, 2011
Priority date	—
Expiry date	Apr 20, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/01079
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a cover plate; depositing a metal layer on a face of the cover plate or on a face of the wafer; covering the wafer with the cover plate; applying a contact pressure equal to at least one bar onto the cover plate and onto the wafer; and heating the metal layer during pressing until a seal is obtained, each cavity thus being provided with a sealing area and being closed by a part of the cover plate and/or its metal layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.