Patent · US Active

Apparatus and methods for constructing antennas using vias as radiating elements formed in a substrate

US7999753B2 · kind B2 · utility

11Cited by

6References

22Claims

0Family size

Assignee

International Business Machines Corporation · US

Inventors

Brian P. Gaucher · Brookfield, US
Duixian Liu · Yorktown Heights, US
Ullrich R. Pfeiffer · Wolfsburg, DE
Thomas Zwick · Leutkirch im Allgäu, DE

Key dates

Filing date	Jul 21, 2008
Grant date	Aug 16, 2011
Priority date	—
Expiry date	Mar 1, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49018
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

Antennas are provided which are constructed using one or more conductive via stubs as radiating elements formed in a substrate. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.