Containment of a wafer-chuck thermal interface fluid

US8002025B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David M. Audette · Webster, US
• Philip J. Diesing · South Burlington, US
• David L. Gardell · Saint Albans, US

Key dates

• Filing date: Apr 28, 2006
• Grant date: Aug 23, 2011
• Expiry date: Jun 23, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67109
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method includes circulating a heat transferring fluid in a substantially closed system including an interstice between a wafer and a chuck at a first pressure. The method further includes pumping the fluid out of the interstice and increasing the pressure of the fluid to a second pressure. The method further includes reducing the pressure of the fluid to the first pressure and returning the fluid to the interstice. In the system, the fluid in the interstice transfers heat from the wafer to the chuck, or vice versa, by conduction. The presence of a conducting fluid in the interstice thereby decreases the resistivity of the interface, and enables more efficient heat transfer from the wafer to the chuck.