Heat processing apparatus for semiconductor process
US8002895B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2007 |
| Grant date | Aug 23, 2011 |
| Priority date | — |
| Expiry date | Nov 28, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/345
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat processing apparatus for a semiconductor process includes a reaction tube including a process field configured to store a plurality of target substrates stacked at intervals. A gas supply duct is integrally provided outside the wall of the reaction tube to extend vertically in a range that covers the process field. A plurality of gas delivery holes are formed in the side portion of the wall of the reaction tube, to be vertically arrayed in a range that covers the process field and communicate with the gas supply duct. A gas supply system is connected to a bottom portion of the gas supply duct to supply a process gas to the process field through the gas supply duct and the plurality of gas delivery holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.