Microfluidic device and a fluid ejection device incorporating the same
US8007078B2 · kind B2 · utility
1Cited by
16References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2010 |
| Grant date | Aug 30, 2011 |
| Priority date | — |
| Expiry date | Oct 4, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1637
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A microfluidic device includes first and second substrates bonded together. The first substrate has first and second opposed surfaces. A die pocket is formed in the first opposed surface, and a through slot extends from the die pocket to the second opposed surface. The second substrate is bonded to the second opposed surface of the first substrate whereby an outlet of a channel formed in the second substrate substantially aligns with the through slot. The channel of the second substrate has an inlet that is larger than the outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.